Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moir6 Interferometry
نویسندگان
چکیده
An experimental investigation dealing with failure characterization of 63/37 soldercopper interfaces is presented. The method of moird interferometry is used for mapping elasto-plastic deformations in bimaterials subjected to predominantly tensile loading. A method for quantifying the fracture parameter--the J-integral--using full-field measurement of crack opening displacements has been developed. A linear relationship between crack tip opening displacements ( CTOD ) and the J-integral is demonstrated. The crack growth resistance curve and hence crack initiation toughness Jc value for the bimaterial is obtained. Full-field optical information has also suggested the possibility of using a simpler method for the J-integral estimation using a single strain gage for fracture testing of interfaces with large mismatch in this geometry.
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Article history: Received 30 December 2010 Received in revised form 27 February 2011 Accepted 2 March 2011 Available online 6 April 2011 0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.03.019 ⇑ Corresponding author. Tel.: +1 607 777 3415. E-mail address: [email protected] (S. Park). This paper focuses on the characterization of the elasto-plastic properties of ...
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